KHP®7026

Standard designation

 

EN: CW111C
UNS: C 70260

Chemical composition

 

Cu: Balance
Ni: 1,60 - 2,50 % 
Si: 0,40 - 0,70 %
P: max. 0,01 %

Physical properties1)

 

Density: 8,82 g/cm³
Electrical conductivity: 23-29 m/Ω·mm² = 40-50 % IACS2)3)
Thermal conductivity: 156 W/m·K
Thermal expansion coefficient: 17·10-6/K
Modulus of elasticity: 130 GPa4)

1) Guideline values for room temperature
2) IACS =International Annealed Copper Standard
3) depending on the temper
4) 1 GPa = 1 kN/mm²

Processing information

 

Weldability: good
Solderability: good
Stress corrosion cracking: none

Mechanical properties

 

Temper

R580/H120

R620/H170

R650/H200

Tensile strength RM

580-660 MPa5)

620-700 MPa

650-730 MPa

Yield strength RP0,2

≥ 520 MPa

≥ 550 MPa

≥ 570 MPa

Elongation A50

≥ 12 %

≥ 10 %

≥ 7 %

Hardness HV

175-205

190-215

195-225


Temper

R720/H220

                    

Tensile strength RM

≥ 720 MPa

 

Yield strength RP0,2

≥ 650 MPa

 

Elongation A50

≥ 3 %

 

Hardness HV

≥ 215

 

5) 1 MPa = 1 N/mm²

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