KHP®15

Standard designation

EN: CuSn0,15/CW117C
UNS: C 14415

Chemical composition

Cu: Balance
Sn: 0,1 - 0,15 % 

Physical properties1)

Density: 8,9 g/cm³
Electrical conductivity: 46 m/Ω·mm² = 80 % IACS2)
Thermal conductivity: 300 W/m·K
Thermal expansion coefficient: 18,0·10-6/K
Modulus of elasticity: 110 GPa3)

1) Guideline values for room temperature
2) IACS =International Annealed Copper Standard
3) 1 GPa = 1 kN/mm²

Processing information

Weldability: good
Solderability: good
Stress corrosion cracking: none

Mechanical properties

Temper

 

R250/H60

R300/H85

Tensile strength RM

 

250-320 MPa

300-370 MPa

Yield strength RP0.2

 

< 200 MPa

≥ 250 MPa

Elongation A50

 

≥ 9 %

≥ 4 %

Hardness HV

 

60-90

85-110


Temper

R360/H110

R420/H120

Tensile strength RM

360-430 MPa

420-490 MPa

Yield strength RP0.2

≥ 300 MPa

≥ 350 MPa

Elongation A50

≥ 3 %

≥ 2 %

Hardness HV

105-130

120-140

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