KHP®109

Standard designation

EN: not standardised*
UNS: C 19025

Chemical composition

Cu: balance
Ni: 0,8 - 1,2 % 
Sn: 0,7 - 1,1 %
P: 0,03 - 0,07 %

Physical properties1)

Density: 8,9 g/cm³
Electrical conductivity: 23 m/Ω·mm² = 40 % IACS2)
Thermal conductivity: 161 W/m·K
Thermal expansion coefficient: 17·10-6/K
Modulus of elasticity: 130 GPa3)

1) Guideline values for room temperature
2) IACS =International Annealed Copper Standard
3) 1 GPa = 1 kN/mm²

Processing information

Weldability: good
Solderability: good
Stress corrosion cracking: none

Mechanical properties

Temper

R335/H120

R440/H135

R500/H155

Tensile strength RM

335-470 MPa4)

440-520 MPa

500-570 MPa

Yield strength RP0,2

≥ 315 MPa

≥ 420 MPa

≥ 480 MPa

Elongation A50

≥ 15 %

≥ 9 %

≥ 5 %

Hardness HV

120-155

135-170

155-180


Temper

R540/H160

R580/H175 R630/H190

Tensile strength RM

540-610 MPa

580-650 MPa 630-730 MPa

Yield strength RP0,2

≥ 520 MPa

≥ 560 MPa

≥ 610 MPa

Elongation A50

≥ 4 %

- -

Hardness HV

160-195

175-210

≥ 190


4) 1 MPa = 1 N/mm²
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