Standard designation
| EN: | CuSn8/CW453K |
| UNS: | C 52100 |
Chemical composition
| Cu: | Balance |
| Sn: | 7,5 - 8,5 % |
| P: | 0,01 - 0,4 % |
Physical properties1)
| Density: | 8,8 g/cm³ |
| Electrical conductivity: | 7,5 m/Ω·mm² = 13 % IACS2) |
| Thermal conductivity: | 62 W/m·K |
| Thermal expansion coefficient: | 18,5·10-6/K |
| Modulus of elasticity: | 115 GPa3) |
1) Guideline values for room temperature
2) IACS =International Annealed Copper Standard
3) 1 GPa = 1 kN/mm²
Processing information
| Weldability: | good |
| Solderability: | very good |
| Stress corrosion cracking: | none |
Mechanical properties
|
Temper |
R370/H90 |
R450/H135 |
R540/H170 |
|
Tensile strength RM |
370-450 MPa4) |
450-550 MPa |
540-630 MPa |
|
Yield strength RP0.2 |
≤ 300 MPa |
≥ 280 MPa |
≥ 460 MPa |
|
Elongation A50 |
≥ 50 % |
≥ 20 % |
≥ 13 % |
|
Hardness HV |
90-120 |
135-175 |
170-200 |
|
Temper |
R600/H190 |
R640/H210 |
R740/H230 |
|
Tensile strength RM |
600-690 MPa |
660-750 MPa |
≥740 MPa |
|
Yield strength RP0.2 |
≥ 530 MPa |
≥ 620 MPa |
≥ 700 MPa |
|
Elongation A50 |
≥ 5 % |
≥3 % |
≥2 % |
|
Hardness HV |
190-220 |
≥ 210-240 |
≥ 230 |