Standard designation
| EN: | not standardized |
| UNS: | not standardized |
Chemical composition
| Cu: | Balance |
| Sn: | 5,0 - 7,0 % |
| Zn: | 5,0 - 7,0 % |
| P: | 0,01 - 0,1 % |
Physical properties1)
| Density: | 8,8 g/cm³ |
| Electrical conductivity: | 9 m/Ω·mm² = 15 % IACS2) |
| Thermal conductivity: | 75 W/m·K |
| Thermal expansion coefficient: | 18,4·10-6/K |
| Modulus of elasticity: | 114 GPa3) |
1) Guideline values for room temperature
2) IACS =International Annealed Copper Standard
3) 1 GPa = 1 kN/mm²
Processing information
| Weldability | good |
| Solderability | good |
| Stress corrosion cracking: | negligible |
Mechanical properties
|
Temper |
R610/H190 |
R760/H230 |
|
Tensile strength RM |
610-690 MPa4) |
≥760 MPa |
|
Yield strength RP0.2 |
≥ 570 MPa |
≥690 MPa |
|
Elongation A50 |
≥ 12 % |
- |
|
Hardness HV |
190-220 |
≥230 |