CuSn10

Standard designation

 

EN: not standardised    
UNS: C 52400

Chemical composition

 

Cu: Rest Balance                
Sn: 9 - 11 %
P: 0,03 - 0,35 %

Physical properties1)

 

Density: 8,75 g/cm³
Electrical conductivity: 6,4 m/Ω·mm² = 11 % IACS2)
Thermal conductivity: 50 W/m·K
Thermal expansion coefficient: 18,4·10-6/K
Modulus of elasticity: 110 GPa3)

1) Guideline values for room temperature
2) IACS =International Annealed Copper Standard
3) 1 GPa = 1 kN/mm²

Processing information

 

Weldability: good
Solderability: very good 
Stress corrosion cracking: none

Mechanical properties

 

 

 

Temper

R400/H120

R480/H140

R550/H170

Tensile strength RM

400-500 MPa4)

480-560 MPa

550-650 MPa

Yield strength RP0,2

≤ 200 MPa

≥ 325 MPa

≥ 410 MPa

Elongation A50

≥ 55 %

≥ 40 %

≥ 30 %

Hardness HV

120-150

140-170

170-200

 

Temper R650/H200 R740/H200 R790/H235 R830/H250

Tensile strength RM

650-750 MPa

740-830 MPa

790-890 MPa

≥ 830 MPa

Yield strength RP0,2

≤ 550 MPa

≤ 680 MPa

≤ 740 MPa

≥ 780 MPa

Elongation A50

≥ 18 %

≥ 9 %

≥ 4 %

≥ 2 %

Hardness HV

200-230

220-250

235-270

≥ 250

  

4) 1 MPa = 1 N/mm²

 

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